Texas Instruments (TXN) Offering Possible 9.89% Return Over the Next 16 Calendar Days

Texas Instruments's most recent trend suggests a bullish bias. One trading opportunity on Texas Instruments is a Bull Put Spread using a strike $50.00 short put and a strike $45.00 long put offers a potential 9.89% return on risk over the next 16 calendar days. Maximum profit would be generated if the Bull Put Spread were to expire worthless, which would occur if the stock were above $50.00 by expiration. The full premium credit of $0.45 would be kept by the premium seller. The risk of $4.55 would be incurred if the stock dropped below the $45.00 long put strike price.

The 5-day moving average is moving up which suggests that the short-term momentum for Texas Instruments is bullish and the probability of a rise in share price is higher if the stock starts trending.

The 20-day moving average is moving up which suggests that the medium-term momentum for Texas Instruments is bullish.

The RSI indicator is above 80 which suggests that the stock is in overbought territory.

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LATEST NEWS for Texas Instruments

Texas Instruments Unveils New Series of MSP430 MCUs
Thu, 06 Nov 2014 21:30:02 GMT

TI DLP® LightCrafter™ Display 3010 evaluation module enables HD projection in compact electronics
Thu, 06 Nov 2014 13:00:00 GMT
PR Newswire – DALLAS, Nov. 6, 2014 /PRNewswire/ — Texas Instruments (TI) (NASDAQ: TXN) today announced the availability of the DLP ® LightCrafter ™ Display 3010 evaluation module, a new developer tool that allows quick …

TI makes programming in real time as easy as 1-2-3
Thu, 06 Nov 2014 12:30:00 GMT
PR Newswire – DALLAS, Nov. 6, 2014 /PRNewswire/ — The programmable real-time unit (PRU) on Sitara™ processors from Texas Instruments (TI) (NASDAQ: TXN) enables customers to differentiate their products by offloading …

New Research in 3D Adaptive Filtering from ContextVision, Texas Instruments and High Performance Consulting
Thu, 06 Nov 2014 08:01:31 GMT
noodls – Research findings to be presented at the IEEE Medical Imaging Conference this week Stockholm, Sweden – November 6, 2014 -At the IEEE medical Imaging Conference (MIC) this week, ContextVision, the leading …

TI to open 300mm wafer bumping facility in Chengdu, China
Thu, 06 Nov 2014 04:00:00 GMT
PR Newswire – CHENGDU, CHINA, Nov. 5, 2014 /PRNewswire/ — Texas Instruments Incorporated (TI) (TXN) today announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu further increases TI's 300mm analog capacity and its ability to support customer demand. TI announced the new operation today in concert with an event celebrating the grand opening of its seventh assembly/test (A/T) facility.

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